High power density module power supply currently occupies a dominant position in China's industry, communications and manufacturing fields. How to achieve low loss and heat dissipation balance of high frequency power supply in the design process has become the number one problem faced by many manufacturers and R & D personnel. This article will be a brief narrative analysis of this issue to help engineers more effectively achieve low-loss high-power power design.
First of all, we take the application in the field of communication as the starting point, and look at the reasons why high-power and high-density power supplies have rapidly occupied the market in recent years. In the field of communication equipment design and development in China, low-power power has always been the main power supply, which directly determines the choice of domestic manufacturers in the distribution of power supply. However, with the continuous upgrading of equipment functions, local centralized power supply has been raised again due to low cost. In this situation, high-power, high-density, and high-reliability module power supplies are increasingly being widely used. This is why high-power density power supplies have gradually become market-dominant since 2010.
At present, the high-power module power supply applied in our country generally adopts the form of half brick or full brick package. This type of power module usually has the following characteristics: First, the high-power density power module adopts the international popular industrial standard package, and the product compatibility is wider. Secondly, the same power volume weight of the product is greatly reduced, only the 1/4 of traditional products. Third, there have been significant improvements in technical indicators, in particular efficiency to 90 per cent. Fourth, the excellent thermal design of the product itself brings lower temperature rise and higher reliability.
So, how can we improve the power density of power module products in the design process? Engineers can start from the following three directions: first, engineers can adopt advanced circuit topology and conversion technology in the circuit design process to achieve high power and low loss; Second, engineers can adapt to the new packaging form by reducing the volume of each component, and effectively reduce its volume by using compact process structure. The third method is to improve the thermal design to make it possible to achieve heat dissipation balance under high power density conditions.
In addition, in the design of the circuit, we can also use the control algorithm and the characteristics of the main power transformer and the output diode to determine the amount of power transmitted from the primary side to the isolated secondary side. This method can also effectively reduce the power loss of the high frequency module power supply.
Reprinted from: power network
